Looking to contact semiconductor manufacturer teams for wet process equipment? Meraif supports Southeast Asia buyers with solutions for silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT—backed by patented nozzle technology, vacuum negative pressure spray cleaning, and supercritical fluid expertise for high-precision semiconductor cleaning.
TFT glass horizontal cleaning machine for flat panel display and semiconductor production lines. It supports continuous panel transfer, wet cleaning, rinsing and drying processes to remove particles, residues and contaminants before coating, bonding, inspection or assembly in cleanroom environments.
The single-wafer wet etching spin processor is suitable for etching metal layers such as UBM and RDL, as well as second- and third-generation 2.5 and 3.5 generation etching. The chamber allows for multi-chemical etching, with precise and controllable swing arm and spraying. Acid and alkali are recycled separately without pollution. The integrated PTFE chamber prevents backsplashing, the entire unit is corrosion-resistant, and the interface is simple, meeting the needs of mass production and engineering.
