Looking to contact semiconductor manufacturer teams for wet process equipment? Meraif supports Southeast Asia buyers with solutions for silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT—backed by patented nozzle technology, vacuum negative pressure spray cleaning, and supercritical fluid expertise for high-precision semiconductor cleaning.
FOUP cleaner system for semiconductor fabs, designed for wafer carrier, SMIF pod and cassette cleaning. Supports global sourcing of scarce equipment, parts and accessories for advanced packaging, wafer handling and SMT automation lines, helping AMD, Intel and US-owned fabs keep stable production up.
The FOUP cleaning machine is a fully automatic centrifugal device compatible with SMIF, FOUP, FOSB, Cassette, and other wafer cassettes. It removes particles and metal ions through 360° rotation and high-pressure DI water rinsing, followed by centrifugal hot air drying, ensuring cleanliness and high efficiency. It supports SECS/GEM200/300 and complies with SEMI S2 and CE semiconductor standards.
