Looking to contact semiconductor manufacturer teams for wet process equipment? Meraif supports Southeast Asia buyers with solutions for silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT—backed by patented nozzle technology, vacuum negative pressure spray cleaning, and supercritical fluid expertise for high-precision semiconductor cleaning.
Fully automatic FOUP cleaning machine designed for semiconductor fabs and wafer handling lines. It supports efficient carrier washing, rinsing and drying to help remove particles, chemical residues and ionic contamination, improving FOUP cleanliness, process stability and production yield overall.
This fully automatic FOUP cleaning machine is specifically designed for cleaning 12-inch FOUP/FOSB particles and metal ions, making it suitable for the semiconductor industry. The equipment employs multi-stage precision filtration to meet Class 10/100 cleanliness standards, provides 360° spray cleaning without blind spots, and is equipped with a vacuum drying system. It supports mainstream communication and automation integration, and complies with SEMI S2 and CE standards.
