Máquina de grabado de capa fina con reverso de cristal
Máquina de grabado de capa fina con reverso de cristal
  1. Máquina de grabado de capa fina con reverso de cristal
  2. Máquina de grabado de capa fina con reverso de cristal

Máquina de grabado de capa fina con reverso de cristal para el proceso de obleas

Designed for crystal back thin film etching, this automated semiconductor machine uses Bernoulli chuck N2 gas support to hold wafers with minimal contact. It helps reduce handling marks, improve process stability, and support precise backside film removal for wafer and advanced packaging production.

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This equipment is suitable for etching 6/8/12-inch thinner wafers. It adopts non-contact transfer support, reduces wafer breakage rate, can flatten warped wafers, has high efficiency in chemical recovery, and is more environmentally friendly and energy-saving.

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