Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
This fully automatic FOUP cleaning machine is designed for semiconductor fabs requiring reliable wafer carrier cleaning, rinsing, and drying. Its enclosed stainless-steel structure supports contamination control, stable operation, and customized integration for advanced manufacturing lines worldwide
This equipment is based on the original semi-automatic FOUP cleaning machine. By adding two sets of cleaning baskets, the maximum number of wafers that can be cleaned at one time is increased. At the same time, the equipment is connected to a fully automatic load port and a buffer device, which enables fully automatic wafer carrier loading/unloading and fully automatic cassette opening, while buffering up to 24 wafer foups of 12-inch wafers.
