¿Desea ponerse en contacto con equipos de fabricantes de semiconductores para equipos de proceso húmedo? Meraif apoya a los compradores del sudeste asiático con soluciones para obleas de silicio, obleas de CI, envasado avanzado, sustratos de CI y SMT, respaldadas por tecnología de boquillas patentada, limpieza por pulverización de presión negativa al vacío y experiencia en fluidos supercríticos para la limpieza de semiconductores de alta precisión.
This fully automatic FOUP cleaning machine is designed for semiconductor fabs requiring reliable wafer carrier cleaning, rinsing, and drying. Its enclosed stainless-steel structure supports contamination control, stable operation, and customized integration for advanced manufacturing lines worldwide
This equipment is based on the original semi-automatic FOUP cleaning machine. By adding two sets of cleaning baskets, the maximum number of wafers that can be cleaned at one time is increased. At the same time, the equipment is connected to a fully automatic load port and a buffer device, which enables fully automatic wafer carrier loading/unloading and fully automatic cassette opening, while buffering up to 24 wafer foups of 12-inch wafers.
