Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
The NEPTECH semi-automatic FOUP cleaning machine is designed for fabs requiring reliable wafer carrier cleaning, rinsing and drying. Stainless-steel structure, viewing door and operator panel support controlled workflows for FOUP, FOSB and reticle pod maintenance, plus global sourcing support today.
The FOUP cleaning machine is an automatic centrifugal cleaning device, compatible with various wafer cassettes such as SMIF, FOUP, FOSB, and Cassette. It removes particles and metal ions through 360° rotation and high-pressure DI water rinsing, followed by centrifugal hot air drying, resulting in excellent cleaning and drying performance. It supports SECS/GEM200/300 and complies with SEMI S2 and CE semiconductor standards.
