¿Desea ponerse en contacto con equipos de fabricantes de semiconductores para equipos de proceso húmedo? Meraif apoya a los compradores del sudeste asiático con soluciones para obleas de silicio, obleas de CI, envasado avanzado, sustratos de CI y SMT, respaldadas por tecnología de boquillas patentada, limpieza por pulverización de presión negativa al vacío y experiencia en fluidos supercríticos para la limpieza de semiconductores de alta precisión.
Industrial FCBGA cleaner for semiconductor packaging and SMT automation lines, designed for IC substrate and panel cleaning before or after processes. It supports high-reliability production with global sourcing for equipment, scarce parts, accessories, and maintenance items for advanced factories.
This equipment is used for post-soldering cleaning of SIP, FCCSP, FCBGA, and advanced packaged PCBA. It features fully automated loading and unloading, efficiently removing flux and impurities to meet the cleanliness requirements of high-precision manufacturing processes. It has wide process adaptability, is compatible with various cleaning agents, and is non-damaging and non-oxidizing to copper, silver, aluminum, etc., ensuring quality and efficiency in mass production.
