Pulitore del substrato FCBGA per la linea di confezionamento dei semiconduttori

This equipment is used for post-soldering cleaning of SIP, FCCSP, FCBGA, and advanced packaged PCBA. It features fully automated loading and unloading, efficiently removing flux and impurities to meet the cleanliness requirements of high-precision manufacturing processes. It has wide process adaptability, is compatible with various cleaning agents, and is non-damaging and non-oxidizing to copper, silver, aluminum, etc., ensuring quality and efficiency in mass production.