Cercate di contattare i team di produttori di semiconduttori per le attrezzature di processo a umido? Meraif supporta gli acquirenti del sud-est asiatico con soluzioni per wafer di silicio, wafer IC, packaging avanzato, substrati IC e SMT, grazie alla tecnologia brevettata degli ugelli, alla pulizia a spruzzo con vuoto a pressione negativa e all'esperienza nei fluidi supercritici per la pulizia di alta precisione dei semiconduttori.
Industrial FCBGA cleaner for semiconductor packaging and SMT automation lines, designed for IC substrate and panel cleaning before or after processes. It supports high-reliability production with global sourcing for equipment, scarce parts, accessories, and maintenance items for advanced factories.
This equipment is used for post-soldering cleaning of SIP, FCCSP, FCBGA, and advanced packaged PCBA. It features fully automated loading and unloading, efficiently removing flux and impurities to meet the cleanliness requirements of high-precision manufacturing processes. It has wide process adaptability, is compatible with various cleaning agents, and is non-damaging and non-oxidizing to copper, silver, aluminum, etc., ensuring quality and efficiency in mass production.
