습식 공정 장비에 대해 반도체 제조업체 팀에 문의하고 싶으신가요? Meraif는 특허받은 노즐 기술, 진공 음압 스프레이 세척, 고정밀 반도체 세척을 위한 초임계 유체 전문성을 바탕으로 실리콘 웨이퍼, IC 웨이퍼, 첨단 패키징, IC 기판 및 SMT용 솔루션을 동남아시아 바이어에게 제공합니다.
Meraif
2006년에 시작
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1504호, 3호실, 1동, 천지안 위완푸, 난산구 난산 서브지구, 난산구, 선전, 광둥성, 중국
반도체 패키징 라인용 FCBGA 기판 클리너
Industrial FCBGA cleaner for semiconductor packaging and SMT automation lines, designed for IC substrate and panel cleaning before or after processes. It supports high-reliability production with global sourcing for equipment, scarce parts, accessories, and maintenance items for advanced factories.
This equipment is used for post-soldering cleaning of SIP, FCCSP, FCBGA, and advanced packaged PCBA. It features fully automated loading and unloading, efficiently removing flux and impurities to meet the cleanliness requirements of high-precision manufacturing processes. It has wide process adaptability, is compatible with various cleaning agents, and is non-damaging and non-oxidizing to copper, silver, aluminum, etc., ensuring quality and efficiency in mass production.
