ウェットプロセス装置の半導体メーカーチームとのコンタクトをお探しですか?メライフは、特許取得済みのノズル技術、真空負圧スプレー洗浄、高精度半導体洗浄のための超臨界流体の専門知識に裏打ちされた、シリコンウェーハ、ICウェーハ、高度なパッケージング、IC基板、SMTのためのソリューションで東南アジアのバイヤーをサポートしています。.
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中華人民共和国広東省深圳市南山区南山小区天健悦湾富1号ビル3室1504室




半導体パッケージングライン用FCBGA基板洗浄装置
Industrial FCBGA cleaner for semiconductor packaging and SMT automation lines, designed for IC substrate and panel cleaning before or after processes. It supports high-reliability production with global sourcing for equipment, scarce parts, accessories, and maintenance items for advanced factories.
This equipment is used for post-soldering cleaning of SIP, FCCSP, FCBGA, and advanced packaged PCBA. It features fully automated loading and unloading, efficiently removing flux and impurities to meet the cleanliness requirements of high-precision manufacturing processes. It has wide process adaptability, is compatible with various cleaning agents, and is non-damaging and non-oxidizing to copper, silver, aluminum, etc., ensuring quality and efficiency in mass production.








