Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
Photoresist removal and metal stripping wafer system for semiconductor wet processing, designed for cleaning, stripping and surface preparation in fabs. We support global sourcing of scarce equipment, parts, accessories and customized automation solutions for wafer manufacturing lines worldwide.
This equipment supports 6/8/12-inch wafers, combining the advantages of batch and single-wafer processes. It integrates solvent immersion, high-pressure resist removal, and two-fluid cleaning. The immersion tank is equipped with megasonic technology and can be flexibly configured. Featuring two-fluid and high-pressure jet cleaning, it delivers excellent resist and particle removal performance. Its modular design allows for expansion, and its stable and consistent program control ensures high wafer cleanliness.
