This equipment supports 6/8/12-inch wafers, combining the advantages of batch and single-wafer processes. It integrates solvent immersion, high-pressure resist removal, and two-fluid cleaning. The immersion tank is equipped with megasonic technology and can be flexibly configured. Featuring two-fluid and high-pressure jet cleaning, it delivers excellent resist and particle removal performance. Its modular design allows for expansion, and its stable and consistent program control ensures high wafer cleanliness.