Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
FOUP cleaner system for semiconductor fabs, designed for wafer carrier, SMIF pod and cassette cleaning. Supports global sourcing of scarce equipment, parts and accessories for advanced packaging, wafer handling and SMT automation lines, helping AMD, Intel and US-owned fabs keep stable production up.
The FOUP cleaning machine is a fully automatic centrifugal device compatible with SMIF, FOUP, FOSB, Cassette, and other wafer cassettes. It removes particles and metal ions through 360° rotation and high-pressure DI water rinsing, followed by centrifugal hot air drying, ensuring cleanliness and high efficiency. It supports SECS/GEM200/300 and complies with SEMI S2 and CE semiconductor standards.
