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습식 공정 장비에 대해 반도체 제조업체 팀에 문의하고 싶으신가요? Meraif는 특허받은 노즐 기술, 진공 음압 스프레이 세척, 고정밀 반도체 세척을 위한 초임계 유체 전문성을 바탕으로 실리콘 웨이퍼, IC 웨이퍼, 첨단 패키징, IC 기판 및 SMT용 솔루션을 동남아시아 바이어에게 제공합니다.

Meraif
2006년에 시작
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반도체 팹용 전자동 FOUP 세척기

This fully automatic FOUP cleaning machine is designed for semiconductor fabs requiring reliable wafer carrier cleaning, rinsing, and drying. Its enclosed stainless-steel structure supports contamination control, stable operation, and customized integration for advanced manufacturing lines worldwide

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This equipment is based on the original semi-automatic FOUP cleaning machine. By adding two sets of cleaning baskets, the maximum number of wafers that can be cleaned at one time is increased. At the same time, the equipment is connected to a fully automatic load port and a buffer device, which enables fully automatic wafer carrier loading/unloading and fully automatic cassette opening, while buffering up to 24 wafer foups of 12-inch wafers.