Cercate di contattare i team di produttori di semiconduttori per le attrezzature di processo a umido? Meraif supporta gli acquirenti del sud-est asiatico con soluzioni per wafer di silicio, wafer IC, packaging avanzato, substrati IC e SMT, grazie alla tecnologia brevettata degli ugelli, alla pulizia a spruzzo con vuoto a pressione negativa e all'esperienza nei fluidi supercritici per la pulizia di alta precisione dei semiconduttori.
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Stanza 1504, Unità 3, Edificio 1, Tianjian Yuewanfu, Sottodistretto di Nanshan, Distretto di Nanshan, Shenzhen, Guangdong, Cina






Forno di riflusso Heller 1809 MK III per la linea di assemblaggio di PCB SMT
Heller 1809 MK III is a high-performance SMT reflow oven for PCB assembly and electronics manufacturing. It delivers stable thermal processing, consistent soldering quality, and reliable continuous production, optimized for EMS factories, semiconductor support applications, and automated SMT lines.
The Heller 1809 MK III Reflow Oven is designed for SMT PCB assembly lines requiring stable thermal control, repeatable soldering results, and dependable production performance. Suitable for EMS, electronics manufacturing, and semiconductor-related applications, this equipment supports continuous operation in demanding factory environments. Its inline design helps improve workflow efficiency while maintaining soldering consistency across batches. As a globally sourced automation solution, it is well suited for production upgrades, replacement projects, and complete SMT line integration. This model is an excellent choice for buyers seeking reliable reflow capability, durable construction, proven performance, easy deployment, and long-term overall industrial electronics assembly value.










