Looking to contact semiconductor manufacturer teams for wet process equipment? Meraif supports Southeast Asia buyers with solutions for silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT—backed by patented nozzle technology, vacuum negative pressure spray cleaning, and supercritical fluid expertise for high-precision semiconductor cleaning.
Industrial FCBGA cleaner for semiconductor packaging and SMT automation lines, designed for IC substrate and panel cleaning before or after processes. It supports high-reliability production with global sourcing for equipment, scarce parts, accessories, and maintenance items for advanced factories.
This equipment is used for post-soldering cleaning of SIP, FCCSP, FCBGA, and advanced packaged PCBA. It features fully automated loading and unloading, efficiently removing flux and impurities to meet the cleanliness requirements of high-precision manufacturing processes. It has wide process adaptability, is compatible with various cleaning agents, and is non-damaging and non-oxidizing to copper, silver, aluminum, etc., ensuring quality and efficiency in mass production.
