Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
Dual fan aluminum heat sink module for semiconductor, SMT, and automation cooling. The 200 x 115 x 85 mm assembly includes two guarded axial fans, pre-wired leads, and a sturdy aluminum heat sink base for machine maintenance, spare part replacement, and reliable thermal control in factory equipment.
Designed for thermal management in semiconductor, SMT, and industrial automation equipment, this dual fan aluminum heat sink assembly supports stable operation where cooling reliability matters. The visible 200 x 115 x 85 mm structure combines two protected axial fans with a machined aluminum heat sink base, helping dissipate heat from electronic modules, controllers, power components, or replacement systems. Pre-wired leads support convenient integration during repair, retrofit, or scarce-part sourcing projects. Suitable for maintenance teams, equipment builders, and factory procurement buyers, it offers a practical cooling solution for production lines requiring dependable spare parts and fast global supply support worldwide today.
