Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
Air and liquid data center rack cooling solution for high-density server rooms, supporting room cooling up to 26kW per rack and in-rack cooling up to 30kW per rack. Chilled-water inline units, containment and heat exchanger integration reduce hot/cold air mixing and improve rack thermal reliability.
Designed for high-density server rooms and data centers, this air and liquid rack cooling solution helps stabilize thermal performance for modern computing loads. It supports room cooling up to 26kW per rack and in-rack cooling up to 30kW per rack, using chilled-water inline units, containment layouts, and heat exchanger integration. By reducing hot and cold air mixing, the system improves cooling efficiency, protects servers, and supports reliable operation for GPU servers, storage systems, AMD EPYC platforms, Intel Xeon platforms, and enterprise racks. It is suitable for new deployments, upgrades, OEM projects, and custom data center infrastructure sourcing needs worldwide today.
