Pretende contactar as equipas de fabricantes de semicondutores para obter equipamento de processo húmido? A Meraif apoia os compradores do Sudeste Asiático com soluções para bolachas de silício, bolachas IC, embalagens avançadas, substratos IC e SMT - apoiadas por tecnologia de bocal patenteada, limpeza por pulverização de pressão negativa a vácuo e experiência em fluidos supercríticos para limpeza de semicondutores de alta precisão.
Custom rigid-flex PCB assembly designed for semiconductor tools and SMT automation equipment. Structure combines rigid boards with flexible interconnects to save space, improve routing efficiency, and support stable electrical performance in compact industrial applications and panelized production.
This custom rigid-flex PCB solution is built for semiconductor equipment, SMT automation systems, and other high-density industrial electronics. By combining rigid circuit sections with flexible ribbon interconnects, it helps reduce connector use, optimize internal space, and improve assembly integration. The panelized design supports efficient manufacturing, while the fine-pitch layout suits compact, precision-driven applications. It is ideal for customers seeking stable board-to-board connection, reliable signal transmission, and streamlined installation in advanced electronic devices. Suitable for prototype development and volume production, this product supports demanding sourcing requirements for global OEM, EMS, and automation industry supply chains, with flexible engineering and sourcing support.
