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Looking to contact semiconductor manufacturer teams for wet process equipment? Meraif supports Southeast Asia buyers with solutions for silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT—backed by patented nozzle technology, vacuum negative pressure spray cleaning, and supercritical fluid expertise for high-precision semiconductor cleaning.

Meraif
Began in 2006
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Contact-Meraif Semiconductor

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Our sales and engineering teams are available 24/7 to provide services related to pricing, engineering, materials, product development, and any other semiconductor-related matters.
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Our offices

Headquarter
Malaysia Address: 25, Lorong Tambun Indah 11, 14100 Simpang Ampat, Penang
Phone: +86 153 1886 3639
Email: [email protected]
Manufacturing Centre
Shenzhen Address: Room 1504, Unit 3, Building 1, Tianjian Yuewanfu, Nanshan Subdistrict, Nanshan District, Shenzhen, Guangdong, China
Phone: +86 534 556 2009
Fax: +86 534 501 5868
Email: [email protected]
Business hours
Monday – Friday: 08:00 – 22:00
Saturday – Sunday: 09:00- 20:00

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Frequently Asked Questions

Share your process stage, product category, wafer or package type, contamination or cleaning challenge, target throughput, and project timeline. For advanced packaging inquiries, it also helps to include gap size, die size, chip pitch, and any DRAM, HBM, MEMS, or CoWoS-related requirements.
Yes. This page is designed to convert early-stage interest into a technical conversation. Buyers can contact Meraif through the RFQ form or email to discuss process fit, application scope, demo requirements, and whether patented nozzle, vacuum cleaning, or SCF technology is the right path.
Provide wafer dimensions, package family, substrate or material type, contamination source, utility conditions, and target production region. If you are evaluating a vacuum cleaning platform, useful inputs include UPH goals, basket size, power supply, exhaust, PCW, and CDA conditions.
Yes. Meraif’s positioning and regional coverage make this page suitable for Malaysia semiconductor technical support inquiries, OEM sourcing coordination, and cross-border wet process equipment discussions across Southeast Asia.
Meraif is a comprehensive solutions provider of wet-process equipment for the electronics manufacturing industry. Our solutions cover silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT processes.
Yes. Meraif provides wet-process solutions for advanced packaging applications and helps customers address demanding cleaning challenges in next-generation semiconductor manufacturing.
Customers choose Meraif because we combine industry experience, specialized wet-process knowledge, proprietary cleaning technology, and broad regional support. Our goal is to help customers achieve higher efficiency, better cleaning results, and more reliable process performance.
Meraif supports customers in semiconductor manufacturing, advanced packaging, IC substrate processing, and SMT production. Our solutions are suitable for applications in automotive electronics, industrial electronics, consumer electronics, and other high-precision manufacturing sectors.
Meraif stands out through its strong technical foundation, specialized wet-process expertise, and proprietary cleaning technologies. Our patented nozzle technology, vacuum negative-pressure spray process, and supercritical fluid technology are designed to improve cleaning efficiency while protecting delicate semiconductor materials.
Our patented nozzle technology is one of KED Technology’s core advantages. It is specifically designed for semiconductor cleaning applications and delivers higher cleaning efficiency and better particle removal compared with conventional nozzles, while helping prevent wafer damage.
Meraif uses precisely engineered cleaning methods to remove fine particles and contamination effectively while minimizing the risk of mechanical or chemical damage to wafer surfaces. This is especially important in advanced semiconductor and packaging processes.
Vacuum negative-pressure spray technology is a cleaning process performed in a vacuum environment. It enables efficient spray cleaning while supporting distillation recovery, making the process more environmentally friendly and reducing water and wastewater generation.