ウェットプロセス装置の半導体メーカーチームとのコンタクトをお探しですか？メライフは、特許取得済みのノズル技術、真空負圧スプレー洗浄、高精度半導体洗浄のための超臨界流体の専門知識に裏打ちされた、シリコンウェーハ、ICウェーハ、高度なパッケージング、IC基板、SMTのためのソリューションで東南アジアのバイヤーをサポートしています。.
メライフ
2006年開始
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中華人民共和国広東省深圳市南山区南山小区天健悦湾富1号ビル3室1504室
SMT PCBアセンブリライン用ヘラー1809 MK IIIリフローオーブン
Heller 1809 MK III is a high-performance SMT reflow oven for PCB assembly and electronics manufacturing. It delivers stable thermal processing, consistent soldering quality, and reliable continuous production, optimized for EMS factories, semiconductor support applications, and automated SMT lines.
The Heller 1809 MK III Reflow Oven is designed for SMT PCB assembly lines requiring stable thermal control, repeatable soldering results, and dependable production performance. Suitable for EMS, electronics manufacturing, and semiconductor-related applications, this equipment supports continuous operation in demanding factory environments. Its inline design helps improve workflow efficiency while maintaining soldering consistency across batches. As a globally sourced automation solution, it is well suited for production upgrades, replacement projects, and complete SMT line integration. This model is an excellent choice for buyers seeking reliable reflow capability, durable construction, proven performance, easy deployment, and long-term overall industrial electronics assembly value.
