Looking to contact semiconductor manufacturer teams for wet process equipment? Meraif supports Southeast Asia buyers with solutions for silicon wafers, IC wafers, advanced packaging, IC substrates, and SMT—backed by patented nozzle technology, vacuum negative pressure spray cleaning, and supercritical fluid expertise for high-precision semiconductor cleaning.
This ultrasonic immersion cleaning machine is designed for semiconductor package and FCBGA substrate cleaning. Its enclosed stainless-steel structure, multi-door process area and automated transfer design support precision washing, rinsing and drying in high-volume SMT and IC production lines.
This fully automatic FOUP cleaner is used for cleaning 12-inch FOUP/FOSB containers. Multi-stage precision filtration meets Class 10/100 cleanliness standards. 360° spraying + vacuum drying (optional) ensures cleanliness and high efficiency. It supports EAP/MES/AMHS, SECS/GEM, and OHT/PGV/AGV connections, and complies with SEMI S2 and CE standards.
