Ищете контакты с командами производителей полупроводников для оборудования для влажных процессов? Компания Meraif предлагает покупателям из Юго-Восточной Азии решения для кремниевых пластин, пластин ИС, современной упаковки, подложек ИС и SMT - с использованием запатентованной технологии форсунок, вакуумной очистки распылением под отрицательным давлением и сверхкритических жидкостей для высокоточной очистки полупроводников.
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Комната 1504, блок 3, здание 1, Tianjian Yuewanfu, Nanshan Subdistrict, Nanshan District, Shenzhen, Guangdong, China



Печь для растопки HELLER 1913 MKIII для линии сборки печатных плат SMT
The HELLER 1913 MKIII is an SMT reflow oven for PCB assembly lines. It delivers stable thermal control, even heating, and reliable soldering quality in continuous production. Ideal for electronics manufacturing and automated SMT processes requiring dependable throughput and consistent results.
HELLER 1913 MKIII is a proven reflow oven solution for SMT production environments that require stable soldering performance and repeatable thermal results. Designed for PCB assembly applications, this equipment supports efficient line integration, smooth board transfer, and reliable processing for high-volume manufacturing. It is well suited for EMS providers, consumer electronics production, industrial electronics, and other automated assembly operations. With its established HELLER platform recognition, the 1913 MKIII is often selected for factories seeking dependable reflow capability, process consistency, and long-term operational value in demanding SMT lines. It also fits refurbishment sourcing, spare parts support, and equipment replacement projects worldwide.







