습식 공정 장비에 대해 반도체 제조업체 팀에 문의하고 싶으신가요? Meraif는 특허받은 노즐 기술, 진공 음압 스프레이 세척, 고정밀 반도체 세척을 위한 초임계 유체 전문성을 바탕으로 실리콘 웨이퍼, IC 웨이퍼, 첨단 패키징, IC 기판 및 SMT용 솔루션을 동남아시아 바이어에게 제공합니다.
Meraif
2006년에 시작
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1504호, 3호실, 1동, 천지안 위완푸, 난산구 난산 서브지구, 난산구, 선전, 광둥성, 중국
SMT PCB 조립 라인용 HELLER 1913 MKIII 리플로우 오븐
The HELLER 1913 MKIII is an SMT reflow oven for PCB assembly lines. It delivers stable thermal control, even heating, and reliable soldering quality in continuous production. Ideal for electronics manufacturing and automated SMT processes requiring dependable throughput and consistent results.
HELLER 1913 MKIII is a proven reflow oven solution for SMT production environments that require stable soldering performance and repeatable thermal results. Designed for PCB assembly applications, this equipment supports efficient line integration, smooth board transfer, and reliable processing for high-volume manufacturing. It is well suited for EMS providers, consumer electronics production, industrial electronics, and other automated assembly operations. With its established HELLER platform recognition, the 1913 MKIII is often selected for factories seeking dependable reflow capability, process consistency, and long-term operational value in demanding SMT lines. It also fits refurbishment sourcing, spare parts support, and equipment replacement projects worldwide.
