The single-wafer wet etching spin processor is suitable for etching metal layers such as UBM and RDL, as well as second- and third-generation 2.5 and 3.5 generation etching. The chamber allows for multi-chemical etching, with precise and controllable swing arm and spraying. Acid and alkali are recycled separately without pollution. The integrated PTFE chamber prevents backsplashing, the entire unit is corrosion-resistant, and the interface is simple, meeting the needs of mass production and engineering.<\/p>","protected":false},"excerpt":{"rendered":"
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