습식 공정 장비에 대해 반도체 제조업체 팀에 문의하고 싶으신가요? Meraif는 특허받은 노즐 기술, 진공 음압 스프레이 세척, 고정밀 반도체 세척을 위한 초임계 유체 전문성을 바탕으로 실리콘 웨이퍼, IC 웨이퍼, 첨단 패키징, IC 기판 및 SMT용 솔루션을 동남아시아 바이어에게 제공합니다.
Meraif
2006년에 시작
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1504호, 3호실, 1동, 천지안 위완푸, 난산구 난산 서브지구, 난산구, 선전, 광둥성, 중국
High-Density BGA Semiconductor Package with Solder Balls
This high-density BGA semiconductor package features a precision solder ball array and flat cap structure for reliable board-level interconnection. Suitable for processors, chipsets, memory, and other IC applications, it supports stable assembly, good heat transfer, and dependable SMT production.
Designed for advanced semiconductor and SMT applications, this BGA package combines a compact footprint with a high-density solder ball layout for secure electrical connection and efficient assembly. Its flat top structure supports reliable integration in processors, chipsets, memory devices, and other complex ICs. Ideal for OEM, EMS, and factory sourcing needs, the package helps improve mounting consistency, thermal performance, and long-term stability in demanding production environments. As part of a one-stop sourcing solution, it is suitable for customers seeking dependable packaging components, scarce semiconductor parts, and supply support for industrial and electronics manufacturing projects across global markets and supply chains.
