습식 공정 장비에 대해 반도체 제조업체 팀에 문의하고 싶으신가요? Meraif는 특허받은 노즐 기술, 진공 음압 스프레이 세척, 고정밀 반도체 세척을 위한 초임계 유체 전문성을 바탕으로 실리콘 웨이퍼, IC 웨이퍼, 첨단 패키징, IC 기판 및 SMT용 솔루션을 동남아시아 바이어에게 제공합니다.
Meraif
2006년에 시작
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1504호, 3호실, 1동, 천지안 위완푸, 난산구 난산 서브지구, 난산구, 선전, 광둥성, 중국
SMT 생산 라인용 HELLER 1707 MK III 리플로우 오븐
The HELLER 1707 MK III is a proven SMT reflow oven built for stable, repeatable soldering in PCB assembly lines. It offers efficient heat transfer, consistent temperature profiling, and dependable throughput for electronics manufacturing, making it ideal for EMS, OEM, and industrial production uses.
HELLER 1707 MK III is a professional SMT reflow oven widely used in PCB assembly and electronics manufacturing lines. Designed for stable thermal performance and repeatable soldering quality, it helps improve process consistency, production efficiency, and finished-board reliability. The machine is suitable for EMS providers, OEM factories, and industrial electronics applications that require dependable reflow capability. With its recognized HELLER platform, the 1707 MK III is a practical choice for customers seeking proven SMT equipment for line upgrades, replacement projects, or complete production solutions. It fits well into automated assembly environments focused on quality and throughput across global factories today.
